Presentation overview
The presentation provides to participants an
overview of high performance PCB design and virtual investigations of PCB
structures & electronic modules for high-speed/high-frequency/high-density
applications and presents, based on numerous figures, formulas, case studies
and examples, a practical approach on development, evaluation, and
manufacturing of on-board interconnection structures. It will cover a large
area of topics, from fundamentals of PCB design to signal integrity issues,
full-wave electromagnetic modeling and simulation, investigation techniques and
CAE-CAD tools. The lecturer will provide also a few useful software tools and
links to various other software tools necessary for advanced
investigation/evaluation of PCB structures and PCB based modules and systems.
CV
Norocel-Dragoş Codreanu, Ph.D., is full
professor at “Politehnica” University of Bucharest (UPB), Romania, Faculty of
Electronics, Telecommunications and Information Technology, Department of
Electronics Technology and Reliability (TEF), being currently the executive
manager of the UPB university research centre “Center for Technological
Electronics and Interconnection Techniques” (UPB-CETTI). He has received his
formal education at UPB, obtaining his M.S. in radio-communications in 1988. He
has joined UPB in 1992, where he has received the Ph.D. degree in 1999, after a
research period at Budapest University of Technology & Economics, Hungary.
He is specialist in electronic packaging and advanced technologies, being
focused on CAE-CAD-CAM for electronic modules/assemblies development,
high-speed/high-frequency PCB/MCM-L design and manufacturing, full-wave
electromagnetic modeling and simulation of planar structures, printed
circuit/wiring board fabrication processes, electronic assembling technologies
and heterogeneous integration (including Lead-Free issues,
fine-pitch/high-density interconnections, package-on-package,
system-in-package, thermal management, a.s.o. Additionally, he has expertise in
IR thermovision/thermography for electrical/electronic systems and in
standardization for the electronics industry. He has been senior researcher or
manager for more than 25 national and international projects focused on
innovation, technology transfer, education and partnerships with industry. He
has authored more than 150 scientific contributions/reports/articles and papers
(author or co-author) and 7 text books (author or co-author) in electronic
packaging and related fields.